Nanotribology and Nanomechanics

Nanotribology and Nanomechanics pdf epub mobi txt 电子书 下载 2026

出版者:Springer Berlin Heidelberg New York
作者:Bhushan, Bharat 编
出品人:
页数:1550
译者:
出版时间:2008-6
价格:$ 190.97
装帧:Hardcover
isbn号码:9783540776079
丛书系列:
图书标签:
  • 纳米摩擦学
  • 纳米力学
  • 纳米材料
  • 表面科学
  • 材料科学
  • 纳米技术
  • 界面科学
  • 微纳机械
  • 原子力显微镜
  • Tribology
  • Nanomechanics
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具体描述

This volume serves as a timely, practical introduction to the principles of nanotribology and nanomechanics and applications to magnetic storage systems, MEMS/NEMS and BioMEMS/bioNEMS. Assuming some familiarity with macrotribology/mechanics, the book comprises chapters by internationally recognized experts, who integrate knowledge of the field from the mechanics and materials-science perspectives. They cover key measurement techniques, their applications, and theoretical modeling of interfaces, each beginning their contributions with macro- and progressing to micro concepts. After reviewing the fundamental experimental and theoretical aspects in the first part, "Nanotribology and Nanomechanics" then treats applications. Three groups of readers are likely to find this text valuable: graduate students, research workers, and practicing engineers. It can serve as the basis for a comprehensive, one- or two-semester course in scanning probe microscopy; applied scanning probe techniques; or nanotribology/nanomechanics/nanotechnology, in departments such as mechanical engineering, materials science, and applied physics. This second, revised edition is substantially enlarged by three new chapters: one new chapter introduces to the theory, physics and characterization of the Lotus-Effect; other new chapters discuss the attaching properties of hairs as realized at gecko feet and present a comprehensive review of structural, mechanical, and tribological properties of various hair and skin as a function of ethnicity, damage, conditioning treatment, and various environments. This title is with a Foreword by Physics Nobel Laureate Gerd Binnig.

好的,这是一本关于材料科学与工程领域的深度专著的详细简介,该书专注于高分子材料的结构、性能及应用,完全避开了“Nanotribology and Nanomechanics”的内容。 --- 《先进高分子复合材料的界面行为与功能化设计》 作者: [此处可设想一位资深学者姓名,例如:张宏伟、李建国] 出版社: [此处可设想一家专业学术出版社名称,例如:晶格科学出版社] ISBN: [此处可设想一组数字] 页数: 约 850 页 (精装) --- 内容概要 《先进高分子复合材料的界面行为与功能化设计》是一部全面而深入的学术专著,系统阐述了现代高分子基复合材料领域的核心科学原理、先进表征技术及其在极端环境下的设计策略。本书聚焦于高分子基体、增强相(纤维、颗粒、纳米片层等)以及关键的界面区域所构成的复杂多相体系,旨在揭示结构-性能-功能之间的内在联系,并为下一代高性能、多功能复合材料的开发提供坚实的理论基础和实用的工程指导。 本书结构严谨,逻辑清晰,内容涵盖了从基础理论推导到尖端实验验证的完整链条,特别强调了在热力学、动力学、流变学以及宏观力学性能之间的跨学科整合。 第一部分:高分子基体的结构热力学与动力学 (约 250 页) 本部分为理解整个复合体系的基石,深入探讨了纯高分子材料及其共混体系的热力学相容性、结晶行为和链段运动规律。 第一章:高分子溶液与熔体的相平衡: 详细分析了Flory-Huggins理论在多组分高分子体系中的应用与局限性,引入了自由体积理论和密度泛函理论(DFT)对高分子熔体结构进行的修正模型。重点探讨了共混物中微相分离的临界条件、相结构演化路径及其对宏观性能的影响。 第二章:高分子固态结构与性能的关联: 聚焦于半结晶聚合物的结晶动力学,包括成核理论(均相/异相成核)、晶体生长速率及球晶尺寸分布的控制。深入讨论了不同类型的微观结构(如取向度、应力诱导的诱导结晶、结晶缺陷)如何调控聚合物的模量、韧性和热变形温度。 第三章:高分子流变学基础与加工性能: 阐述了高分子熔体在剪切和拉伸场下的非牛顿行为,包括剪切变稀、应力松弛和粘弹性响应。重点分析了高分子链缠结网络密度对加工过程中的取向和应力积聚的影响,并引入了动态力学分析(DMA)和宽频介电谱(BDS)在高分子动态转变研究中的应用。 第二部分:增强相的特性与界面粘接机制 (约 300 页) 本部分将研究的焦点转移到增强相材料(如碳纤维、玻璃纤维、特定无机填料)的固有属性,以及它们与高分子基体之间相互作用的本质。 第四章:增强相的表面能与改性: 详细分类了不同类型增强纤维(碳纤维、芳纶、玄武岩纤维)的表面化学性质。重点介绍了通过等离子体处理、化学接枝、偶联剂修饰等技术,精确调控填料表面的极性、粗糙度和官能团密度,以优化基体润湿性和初始粘接力。 第五章:界面区(Interphase)的形成与表征: 这是一个核心章节,探讨了界面区作为“过渡层”的特殊地位。界面区的高分子链段运动受限制,形成不同于本体的“束缚高分子层”。本书引入了多种先进技术,如固态核磁共振(ssNMR)和深度X射线光电子能谱(XPS),来量化界面层的厚度、链段的限制程度及其局部热力学状态。 第六章:界面破坏与载荷传递效率: 理论分析了复合材料中载荷从基体向增强相有效传递的机制。通过分子动力学模拟(MD Simulation)验证了界面强度对宏观拉伸强度和层间剪切强度(ILSS)的直接影响。讨论了界面弱化(如湿热老化)对材料长期可靠性的威胁。 第三部分:复合材料的宏观力学性能与多尺度建模 (约 200 页) 本部分侧重于将微观和介观层面的理解提升至工程应用所需的可预测的宏观性能。 第七章:宏观力学行为的预测模型: 综述了经典的混合律、Halpin-Tsai方程以及基于连续介质力学的Voigt/Reuss模型。更进一步,引入了基于 Mori-Tanaka 方案的有效介质理论(EMT)来处理非均匀分散体系的等效弹性模量计算。详细讨论了各向异性复合材料的应力-应变响应。 第八章:失效模式与损伤容限: 系统分析了高分子复合材料在不同载荷条件下的失效路径,包括基体开裂、纤维拔出、分层(Delamination)和纤维断裂。重点探讨了韧化技术,如使用橡胶粒子或热塑性嵌段共聚物来增韧环氧树脂体系,提升材料的断裂韧性($K_{IC}$)。 第九章:多尺度建模与数值模拟: 介绍了将微观界面数据输入到介观和宏观有限元分析(FEA)中的策略。展示了如何利用微观结构信息进行网格划分,并成功模拟层压板的冲击响应、疲劳裂纹萌生与扩展过程。 第四部分:功能化设计与前沿应用 (约 100 页) 最后一部分关注如何利用界面工程和结构设计赋予复合材料额外的功能,超越单纯的结构支撑作用。 第十章:导电与导热复合材料的界面控制: 探讨了通过引入导电填料(如碳纳米管、石墨烯片)来构建贯穿基体的导电网络。关键在于优化填料间的接触电阻和分散均匀性。同样,热界面管理对于导热复合材料(如用于电子封装)至关重要,需要确保填料间的有效热接触路径。 第十一章:自修复与响应性复合材料: 介绍了将微胶囊或血管网络集成到复合材料中实现“自修复”功能的设计理念。讨论了如何利用温度敏感聚合物或形状记忆聚合物作为基体,设计出具有可逆或响应特性的智能复合系统。 目标读者 本书面向材料科学、高分子化学、机械工程、航空航天工程及土木工程领域的研究人员、高级本科生、研究生以及致力于开发高性能结构件和功能材料的行业工程师。 核心特色 1. 深度整合: 首次将高分子物理的热力学与界面化学的粘接机理,以及先进的宏观力学模型进行了系统的、可追溯的逻辑整合。 2. 实验与模拟并重: 书中大量结合了如固体NMR、同步辐射X射线散射、高分辨透射电镜(HRTEM)等前沿实验技术的数据与分子动力学(MD)、密度泛函理论(DFT)的计算结果进行交叉验证。 3. 工程导向: 提供的模型和参数不仅具有理论深度,更直接服务于工业界对材料寿命预测、界面优化和性能提升的需求。 --- 总而言之,《先进高分子复合材料的界面行为与功能化设计》 不仅仅是一本教科书,更是一部为解决当代高分子复合材料设计中遇到的复杂界面问题和性能瓶颈而编写的综合性参考手册。它提供了从原子尺度到工程尺度的全景视角,是推动下一代先进材料设计与制造领域发展的关键文献。

作者简介

Dr. Bharat Bhushan received an M.S. in mechanical engineering from the Massachusetts Institute of Technology in 1971, an M.S. in mechanics and a Ph.D. in mechanical engineering from the University of Colorado at Boulder in 1973 and 1976, respectively, an MBA from Rensselaer Polytechnic Institute at Troy, NY in 1980, Doctor Technicae from the University of Trondheim at Trondheim, Norway in 1990, a Doctor of Technical Sciences from the Warsaw University of Technology at Warsaw, Poland in 1996, and Doctor Honouris Causa from the National Academy of Sciences at Gomel, Belarus in 2000. He is a registered professional engineer (mechanical). He is presently an Ohio Eminent Scholar and The Howard D. Winbigler Professor in the Department of Mechanical Engineering, Graduate Research Faculty Advisor in the Department of Materials Science and Engineering, and the Director of the Nanotribology Laboratory for Information Storage & MEMS/NEMS (NLIM) at the Ohio State University, Columbus, Ohio. He is an internationally recognized expert of tribology and mechanics on the macro- to nanoscales, and is one of the most prolific authors. He is considered by some a pioneer of the tribology and mechanics of magnetic storage devices and a leading researcher in the fields of nanotribology and nanomechanics using scanning probe microscopy and applications to micro/nanotechnology. He has authored 5 technical books, more than 50 handbook chapters, more than 500 technical papers in referred journals, and more than 60 technical reports, edited more than 25 books, and holds 16 U.S. patents. He is co-editor of Springer NanoScience and Technology and co-editor of Microsystem Technologies – Micro- & Nanosystems and Information Storage & Processing Systems (formerly called Journal of Information Storage and Processing Systems). He has given more than 250 invited presentations on five continents and more than 60 keynote/plenary addresses at major international conferences.

Dr. Bhushan is an accomplished organizer. He organized the first symposium on Tribology and Mechanics of Magnetic Storage Systems in 1984 and the first international symposium on Advances in Information Storage Systems in 1990, both of which are now held annually. He is the founder of an ASME Information Storage and Processing Systems Division founded in 1993 and served as the founding chair during 1993-1998. His biography has been listed in over two dozen Who's Who books including Who's Who in the World and has received more than two dozen awards for his contributions to science and technology from professional societies, industry, and U.S. government agencies. He is also the recipient of various international fellowships including the Alexander von Humboldt Research Prize for Senior Scientists, Max Planck Foundation Research Award for Outstanding Foreign Scientists, and the Fulbright Senior Scholar Award. He is a foreign member of the International Academy of Engineering (Russia), Byelorussian Academy of Engineering and Technology and the Academy of Triboengineering of Ukraine, a honorary member of the Society of Tribologists of Belarus, a fellow of ASME, IEEE, STLE, and the New York Academy of Sciences, and a member of ASEE, Sigma Xi and Tau Beta Pi.

Dr. Bhushan has previously worked for the R & D Division of Mechanical Technology Inc., Latham, NY; the Technology Services Division of SKF Industries Inc., King of Prussia, PA; the General Products Division Laboratory of IBM Corporation, Tucson, AZ; and the Almaden Research Center of IBM Corporation, San Jose, CA.

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