Materials for Advanced Packaging pdf epub mobi txt 电子书 下载 2025
出版者:Springer
作者:Lu, Daniel (EDT)/ Wong, C. P. (EDT)
出品人:
页数:732
译者:
出版时间:2008-12-10
价格:USD 129.00
装帧:Hardcover
isbn号码:9780387782188
丛书系列:
图书标签:
- Package
- 先进封装
- 材料科学
- 电子封装
- 集成电路
- 半导体
- 微电子
- 封装技术
- 可靠性
- 器件物理
- 材料工程
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具体描述
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
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