Solder Joint Reliability Prediction for Multiple Environments pdf epub mobi txt 电子书下载 2025

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Perkins, Andrew Eugene

2008-10

212

$ 168.37

9780387793931

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发表于2025-06-02

Solder Joint Reliability Prediction for Multiple Environments epub 下载 mobi 下载 pdf 下载 txt 电子书下载 2025

Solder Joint Reliability Prediction for Multiple Environments pdf epub mobi txt 电子书下载 2025

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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Solder Joint Reliability Prediction for Multiple Environments 下载 mobi epub pdf txt 电子书