Advanced Electronic Packaging pdf epub mobi txt 电子书 下载 2025
- 电子
- 技术
- 工程
- 封装
- 电子封装
- 先进封装
- 集成电路封装
- 微电子
- 封装技术
- 电子材料
- 热管理
- 可靠性
- SMT
- BGA
具体描述
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
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