Advanced Electronic Packaging pdf epub mobi txt 电子书下载 2024

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Ulrich, Richard K. (EDT)/ Brown, William D. (EDT)

John Wiley & Sons Inc

2006-3

840

1258.00 元

HRD

9780471466093

图书标签: 电子技术工程封装

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发表于2024-11-23

Advanced Electronic Packaging epub 下载 mobi 下载 pdf 下载 txt 电子书下载 2024

Advanced Electronic Packaging pdf epub mobi txt 电子书下载 2024

图书描述

As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Advanced Electronic Packaging 下载 mobi epub pdf txt 电子书