Fundamentals of Microsystems Packaging

Fundamentals of Microsystems Packaging pdf epub mobi txt 电子书 下载 2025

出版者:McGraw-Hill Professional
作者:Tummala, R. R.
出品人:
页数:967
译者:
出版时间:2001-5
价格:$ 136.45
装帧:
isbn号码:9780071371698
丛书系列:
图书标签:
  • Microsystem 
  • 专业 
  • packaging 
  • Packaging 
  • IC 
  •  
想要找书就要到 小美书屋
立刻按 ctrl+D收藏本页
你会得到大惊喜!!

This is the only book to teach microsystems packaging - written by the field's leading author. This is the book that engineers, technicians, and students want - the first to teach microsystems packaging from the ground up. Rao Tummala's one-stop "Fundamentals to Microsystems Packaging" covers the field from wafer to systems, including every major contributing technology. It's the only book to do so.This much-needed tool features: a comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems; rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology; easy-to-read schematics and block diagrams; fundamental approaches to all system issues; examples of all common configurations and technologies - wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others; details on chip-to-board connections, sealing and encapsulation, and manufacturing processes; basics of electrical and reliability testing; hundreds of explanatory two-color illustrations; self-test problems and solutions in every chapter; and, glossary. This title provides the best way to learn microsystems packaging through self-study or in a classroom - and the most comprehensive on-the-job reference. It covers MICROSystems packaging from the ground up.

具体描述

读后感

评分

评分

评分

评分

评分

用户评价

评分

评分

评分

评分

评分

本站所有内容均为互联网搜索引擎提供的公开搜索信息,本站不存储任何数据与内容,任何内容与数据均与本站无关,如有需要请联系相关搜索引擎包括但不限于百度google,bing,sogou

© 2025 book.quotespace.org All Rights Reserved. 小美书屋 版权所有